Lyles College of Engineering
Device Engineering Lab Equipment
The Device Engineering Lab recently had a major renovation both in terms of facilities and new equipment installation. Dr. Zoulikha Mouffak received a grant from the DoD that allowed her to purchase the equipment listed below:
| Vendor | Item Description |
|---|---|
| FILMETRICS | Profilm 3D & Vibration Isolation |
| FILMETRICS | Thin Film Measurement System |
| KURT J. LESKER | COSMO Thermal Evaporation system |
| MTI CORPORATION | Furnace system |
| SAMCO | Compact Etcher |
| SIGNATONE | Economy Hybrid Probe Station |
| SUSS MICROTEC | Mask Aligner System |
| TEKTRONIX INC. | Device Characterization System. 4200A with I-V and C-V capabilities |
(a) RIE System
(b) Mask Aligner (Photolithography)
(c) Thermal Evaporator
(d) Tektronix (Keithley) I-V C-V Characterization
(e) Probe Station
(f) Furnace
(g) 3D Profilometer
(h) Thin Film measurement System
Figure 2. Equipment purchased with the DoD grant; Samco reactive ion etching (a),Suss mask aligner with a spin coater (b), Kurt Lesker thermal evaporation (c), Keithley- Tectonix I-V and C-V characterization (d), Signatone probe station (e), MTI furnace (f), Filmetrics 3 D profilometer (g), and Filmetrics thin film measurement tool (h).
Fig 3. Clean room (Room EE 228) (The room hosts 2 Thin film measurement tools, the mask
aligner and the furnace)
Fig 4. Lab room EE 229 (The room hosts the COSMO thermal evaporator, the SAMCO RIE etcher,
and the Filmetrics surface analysis tool)